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We use various test methods that determine the behavior of material samples under extreme mechanical or thermal stresses.
Static and dynamic observation of surface changes under tensile and compressive load, crack growth, delamination phenomena, formation of slip regions. Tension and compression modules usable in most scanning electron microscopes
Static or dynamic observation of surface changes under load, crack growth, delamination phenomena, formation of slip regions. Bending modules usable in most scanning electron microscopes.
In microscopy, hardness testing is one of the most complex. Our equipment is perfectly designed for all samples, from small to large, hard or soft, and also takes into consideration the requirements of different measurement methods.
The clamps are designed for use with Kammrath & Weiss modules. Find the optimal clamping for your application or contact us. We will be happy to support you.
