Bending Module 5kN (top view)

For 3- and 4-Point-Bending Experiments; Extremely Rigid Bending Substage, Highest Drive Resolution

This deformation device can be easily mounted to the specimen stage of the SEM, just like a large size sample. To switch from 3-point bending to four-point bending is a matter of a few seconds, just exchanging the "anvil" on which the specimen rests in center. The specimens should be 28 to 40 mm long, no wider than 15 mm wide, and up to 4 mm thick
The design is based upon two important thoughts: the whole device is extremely rigid providing negligible flexure, and finest movement resolution of the load frame. Both these features are important with very brittle specimens, such as ceramics. After the finest initial cracks have formed, the specimen will not fly apart spontaneously. The bending process can be continued slowly, with extraordinary fine displacement resolution. The experiment can be stopped comfortably, to record finest crack propagation. The area of interest always remains in the focal plane, so that - if at all - only minute corrections need to be done (in 4-point bending, the specimen flexes upwards a few microns, in 3-point bending it remains perfectly stationary in the center area, throughout the entire experiment). Two easy to exchange gearboxes cover the displacement speed ranges from 0,05 to 4 µm/sec, and 2 to 150 µm/sec.
The manual drive and recording electronics show the displacement and load readings on an LED-display. The "Supermouse" handpiece controls the load/relax command with two buttons, and the movement speed with a fine non-incremental potentiometer. BNC-plugs at the rear of the controller provide signals for an XY-plotter, allowing to record load/time, or load/displacement hardcopy diagrams.
A PC-controlled microprocessor unit together with an advanced software package is also available. It offers a large selection of experiment parameters, cyclic experiments, saving and returning to previously recorded files, and a great number of sub-routines.
Specifications: 3-Point and 4-Point Bending Module, 5kN
This device is a member of a "family" of testing substages which may all run from the same controller.
Applications
Static or dynamic observation of surface changes under controlled mechanical load; crack growth, delamination phenomenae, formation of slip planes etc.
Metals, ceramics, glass, ceramic bulk materials or layers, galvanic coatings, soldered or welded joints, minerals, wood, organic materials. This materials testing device fits most of today's SEMs specimen stages. Three small standoffs allow to place it under a light microscope.
Performance
  • Load Ranges: 50N, 100 N, 200 N, 500 N, 1 000 N, 2 000 N and 5 000 N
  • Specimen dimensions (maximum sizes): 40 mm x 15 mm x 4 mm
  • Deformation speed range: 0.05 to 4 µm/sec, or 2 to 100 µm/sec
  • Displacement range: 0 to 5 mm per experiment; the displacement gauge plunger can be zeroed or re-zeroed
  • Electrical connection: 220 or 110 V AC. A 15-pin plug at the chamber wall of the SEM is supplied with the set
  • Dimensions in mm (width/length/height): 100 x 120 x 55 mm
Option
Additional kit for the observation of the concave side of a flexed specimen. Same load range. This kit is not retrofittable if module was not pre-tooled. Please consider retrofit (no charge for pre-tooling), if this observation mode may be of future interest, and indicate when ordering the module.
Controllers
Choice between manual controller (Starter system), and microprocessor controller (DDS-3) with interface and software (MDS) for PC-operation.

Pic.1: Bending Module 5 000 N

Pic.1: Bending Module 5 000 N

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