Bending Module 200N

"Top & Side" - 200N Bending Module for 3- and 4-Point Bending Experiments

The "electron beam" symbolizes the microscope's viewing direction - regardless if a light microscope, an AFM, or an ultrasonic microscope (SAM, and ELSAM) is used. The latter two usually work at very short working distances. Therefore the designer made sure that there is enough clearance near the specimen for good access - from the top and from the side.
Specifications
Bending Module for 3- and 4-Point-Bending Experiments, 200 N
This device is a member of a "family" of testing attachments which may all run from the same controller. This multi-purpose testing device allows viewing the specimen's top and side. The specimen may stay inside the device without changing the applied load, when changing the viewing direction, or taking it to a different microscope.
Applications
Static or dynamic observations of surface changes under controlled mechanical load, crack growth, delaminating phenomenae, formation of glide planes etc.
Metals, ceramics, glass, ceramic bulk materials or layers, galvanic coatings, soldered or welded joints, minerals, wood, organic materials. This materials testing, device fits most of today's SEM specimen stages. Three small standoffs allow to place it under a light microscope. It was designed primarily for the use under a Nanoscope III, but small attachments allow the use of stand-alone AFMs. There is also enough clearance for experiments under a scanning acoustic microscope (SAM).
Performance
  • Load ranges: from 0 ... 0.2 up to 0 ... 200N
  • Specimen dimensions (maximum sizes): 48 x 10 x 4 mm
  • Deformation speed range: 0.5 to 100 µm/sec.
  • Bending displacement range: 0 to 5 mm per experiment; the displacement gauge plunger can be zeroed or re-zeroed over almost a centimeter
  • Electrical connection: 220 or 110 V AC. A 15-pin plug at the chamber wall of the SEM is supplied with the set
  • Dimensions in mm (width/height/length): 40 x 40 x 180 mm
Controllers
Choice between manual controller (Starter system), and microprocessor controller (DDS-3) with interface and software (MDS) for PC-operation.

Pic. 1 Beam is looking at the top surface.

Pic.1: The beam is looking at the top surface of the specimen

Pic.2: The beam is looking at the cut surface of the specimen

Pic.2: The beam is looking at the cut surface of the specimen

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