Bending Module 200 to 5 000 N
For 3- and 4-Point-Bending Experiments; Extremely Rigid Bending Substage, Highest Drive Resolution
This deformation device was originally designed to fit underneath the cantilever of the AFM "NANOSCOPE III, Series 3 000". It is manufactured high-vacuum compatible, so you may also use it in the SEM. Changing from 3-point to 4-point bending is a matter of a few seconds, just exchanging the "anvil" on which the specimen rests in center. The specimens should be 35 to 50 mm long, no wider than 15 mm, and up to 8 mm thick.
The design is based upon two important thoughts: the whole device is extremely rigid; therefore almost no intrinsic flexure is detectable. Another advantage is the ultra-fine movement resolution of the load frame. Both these features are important with very brittle specimens, such as ceramics: after the finest initial cracks have formed, the specimen will not fly apart spontaneously. The bending process can be continued slowly, with extraordinary well defined load increase. The area of interest always remains stationary, so that - if at all - only minute corrections need to be done (in 4-point bending, the specimen flexes forward a few microns, in 3-point bending it remains perfectly stationary in the center area, throughout the entire experiment). The displacement speed range covers 0.2 to 150 µm/sec.
The manual drive and recording electronics shows the displacement and load readings on an LED-display. The "Supermouse" handpiece controls the load/relax command with two buttons, and the movement speed with a smooth precision potentiometer. BNC-plugs at the rear of the controller provide signals for an XY-plotter, allowing to record load/time, or load/ displacement hardcopy diagrams.
PC-controlled microprocessor unit together with an advanced software package is also available. It offers a large selection of experiment parameters, cyclic experiments, saving and returning to previously recorded files, event-markers, and a great number of other sub-routines. Insert: 3-point bending test on a carbon fiber reinforced Mg-alloy sample. The specimen broke at 1 500 mPa. The reading of the bending displacement at that point was just below 900 µm.
Courtesy Swiss Federal Laboratories for Materials Testing and Research (EMPA) Thun, Switzerland, B. Moser.
Specifications: 3-Point and 4-Point Bending Module, 5 000 N
Viewing the Sectional Surface of the Specimen Under Load
This device is a member of a group of testing substages, running with the same controller.
Static or dynamic observations of surface changes under controlled mechanical load; crack growth, delaminating phenomenae, formation of glide planes etc.
Metals, ceramics, glass, ceramic bulk materials or layers, galvanic coatings, soldered or welded joints, minerals, wood, organic materials. This materials testing device fits most of today's SEMs specimen stages. Three small standoffs allow to place it under a light microscope.
- Load Ranges: 200 N, 500 N, 1 000 N, 2 000 N, 5 000 N - others upon request
- Specimen dimensions (maximum sizes): 50 mm x 10 mm x 4 mm
- Deformation speed range: 0.2 to 150 µm/sec
- Displacement range: 0 to 5 mm per experiment; the displacement gauge plunger can be zeroed or re-zeroed over more than a centimeter
- Electrical connection: 220 or 110 V AC. A 15-pin plug at the chamber wall of the SEM can be supplied with the set
- Dimensions in mm (width/length/height): 100 mm (170 mm with heavy duty motor) x 130 mm x 55 mm
Choice between manual controller (with "Supermouse"), and microprocessor with interface and software for PC-operation. Return set to manufacturer for later change or addition of the controller.